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Thermal Conductivity Enhancement of Copper Foam-Paraffin Phase Change Materials

. Muhammad Alam Zaib Khan, Fawad Ali & Muhammad Ali Kamran


Abstract

Phase change materials (PCMs) play a crucial role in thermal energy storage systems due to their heat transport and storage capabilities. However, their low thermal conductivity limits the rate of energy storage and release. Incorporating copper metal foam into PCMs can significantly improve their thermal conductivity. This study investigates the thermal conductivity enhancement of a metal foam-paraffin composite compared to pure paraffin. The copper metal foam, known for its high thermal conductivity, effectively increases the heat transfer rate within the composite. Theoretical and experimental thermal conductivity measurements of the copper foam/PCM composite were conducted and compared. Results demonstrated that the composite's thermal conductivity reached 5.5 W/mK at 13 W, substantially higher than the 0.2 W/mK of pure PCM. Additionally, the copper/PCM composite reduced the temperature of the heat sink by 25-30%. This enhancement is attributed to the improved thermal pathways provided by the copper foam's structure, despite the inverse relationship between infiltration ratio and pore density.

 

Index Terms- Aluminium Heat Sink, Copper Metal Foam, Paraffin, Phase Change Material

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