Through the application of Fourier's law, it is conceivable to examine the thermal conductivity of both carbon and copper fluid with copper-chromium, bringing potentially a promising perspective for the fabrication of materials possessing enhanced thermal transfer properties. In this Research, the estimated thermal conductivity values of a composite established with the Fourier Law will be compared.  The research carried out illustrates how the migration of Copper-Chromium (Cu-Cr) from the matrix to the interface modifies the thermal conductivity of carbon/copper (C/Cu) composites. For estimating heat flow values across various Cu-Cr material thicknesses, C/Cu composites were adopted. Heat transfer coefficients have recently been the object of several studies in literature, however, the vast majority of these are based on experimentation with little basic theoretical work available. The challenges encountered in understanding high-temperature and vacuum configurations may be partially responsible for this research gap. A numerical simulation methodology for analyzing heat was introduced in the study. An analytical-numerical simulation framework for the solid carbon/liquid copper-chromium system has been provided in the article.

Keywords: Mathematical modeling. Thermal conductivity, Heat flux, Carbon-copper composite, Copper- base alloy